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
6英寸晶圆检测显微镜:可靠观察细微高度差异
本文介绍了一种配备自动化和可重复的DIC(微分干涉对比)成像的6英寸晶圆检测显微镜,无论用户的技能水平如何。制造集成电路(IC)芯片和半导体组件需要进行晶圆检测,以验证是否存在影响性能的缺陷。这种检测通常使用光学显微镜进行质量控制、故障分析和研发。为了有效地可视化晶圆上结构之间的小高度差异,可以使用DIC。
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![[Translate to chinese:] Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface. [Translate to chinese:] Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface. The inset images in the upper left corner show the brightfield image (above) and fluorescence image (below with dark background).](/fileadmin/_processed_/a/1/csm_Organic_contamination_on_a_wafer_surface_6699165cee.jpg)
晶圆上的光刻胶残留和有机污染物的可视化
随着半导体上集成电路(IC)的尺寸低于10纳米,在晶圆检测中有效检测光刻胶残留等有机污染物和缺陷变得越来越重要。光学显微镜仍然是常见的检测方法,但对于有机污染物,明场和其他类型的照明可能会存在局限性。本文讨论了荧光显微镜如何在半导体行业的QC、故障分析和研发过程中有效检测晶圆上的光刻胶残留和其他有机污染物。
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![[Translate to chinese:] Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope. [Translate to chinese:] Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.](/fileadmin/_processed_/7/6/csm_Burrs_at_the_edge_of_a_battery_electrode_b8ae4a8491.jpg)
电池制造过程中的毛刺检测
毛刺是电池电极片边缘可能出现的缺陷,例如在制造过程中的分切环节。它们可能会因诸如短路等故障导致电池性能下降,并引发安全和可靠性问题。毛刺检测是电池生产质量控制的重要部分,对于生产具有可靠性能和寿命的电池至关重要。通过适当照明的光学显微镜可以在生产过程的关键步骤中快速可靠地对电极上的毛刺进行视觉检测。
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![[Translate to chinese:] Particulate contamination in between moving metal plates. [Translate to chinese:] Particulate contamination in between moving metal plates.](/fileadmin/_processed_/b/d/csm_Particulate_contamination_in_between_moving_metal_plates_2_3571994896.jpg)
高效清洁度分析的关键因素
在汽车和电子行业,零部件上细小的污染颗粒物也可能影响产品的性能,导致产品出现故障,或使用寿命缩短。对于汽车来说,过滤系统很容易受到影响。对于电子产品来说,印刷电路板(PCB)或连接器上的污染可能会导致短路。因此,清洁度在现代制造业的质量控制中占有核心地位,特别是使用由不同供应商生产的部件时,更要重点关注清洁情况。车辆或设备的关键部件如果受到污染,整个系统就可能发生故障。因此,高效清洁度分析过程必须…
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![[Translate to chinese:] Preparation of an IC-chip cross section: grinding and polishing of the chip cross section. [Translate to chinese:] Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.](/fileadmin/_processed_/3/b/csm_Grinding_polishing_EM_TXP_81f93bc20c.jpg)
电子产品制造截面分析
本文将讨论印刷电路板 (PCB) 和总成 (PCBA)、集成电路 (IC) 和电池组件的横截面为什么对质量控制 (QC)、故障分析 (FA) 和研发 (R&D) 有效,以及如何制备这些横截面。
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![[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest. [Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.](/fileadmin/_processed_/a/c/csm_IC_chip_cross_section_c413bcc998.jpg)
横截面切片法分析IC芯片的结构与化学成分
从本文中了解如何通过横截面分析法对集成电路 (IC) 芯片等电子元件进行有效的结构和元素分析。探索如何通过研磨系统进行铣削、锯切、磨削和抛光工艺以及用于同时进行目视检测和化学分析的二合一解决方案来完成的。可针对电子行业的各种工作流程和应用实现快速、详细的材料分析,包括竞争分析、质量控制 (QC)、故障分析 (FA) 以及研发 (R&D)。
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
考虑采购体视显微镜时的关键因素
体视显微镜通常是实验室或生产现场“主力”。用户需要花费数小时通过目镜来检查、观察、记录或解剖样本。仔细评估哪些相关应用需要用到体视显微镜,是确保长期满意使用的关键所在。决策者们需要确保自己能够完全依照自己的需求来定制仪器。为帮助用户能更好的选择适合自己的体视镜,本文介绍了几个主要考虑的因素。