![[Translate to chinese:] Documentation of an automotive clutch friction surface with a digital microscope dvm6_auto_fig_teaser_jan_2022.jpg](/fileadmin/_processed_/f/2/csm_dvm6_auto_fig_teaser_jan_2022_916a992f11.jpg "[Translate to chinese:] Documentation of an automotive clutch friction surface with a digital microscope")
在汽车零部件的开发和生产过程中，无论是供应商还是汽车制造商，都必须符合规格要求。这些规格对保持汽车和其他车辆在生命周期内的性能标准和安全运行至关重要[1,2,3]。在满足或超越日益严格的质量标准的同时，对更高效和更具成本效益的零部件开发和生产的需求一直在提高。本文解释了如何用数码显微镜轻松快速地研究和记录零件以确定其是否符合规格要求。
下表显示了使用DVM6进行汽车零部件研究和记录时的优势。
优势 | DVM6的功能 | |
快速概览 | 二维成像 | X-Y拼接 |
快速便捷的放大倍率转换 | 16:1变焦光学元件 | 低、中、高倍数物镜 |
快速改变观察视角 | 倾斜，±60° | 样品旋转，±180° |
快速3D模型 | 3D成像 | 扩展景深 |
多样化的对比度方法 | 集成环形和同轴光照 | |
易于使用和图像分析 | 直观的LAS X软件 | |
本文介绍了一种配备自动化和可重复的DIC（微分干涉对比）成像的6英寸晶圆检测显微镜，无论用户的技能水平如何。制造集成电路（IC）芯片和半导体组件需要进行晶圆检测，以验证是否存在影响性能的缺陷。这种检测…
![[Translate to chinese:] Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface. The inset images in the upper left corner show the brightfield image (above) and fluorescence image (below with dark background).](/fileadmin/_processed_/a/1/csm_Organic_contamination_on_a_wafer_surface_7072894d1c.jpg "[Translate to chinese:] Optical microscope image, which is a composition of both brightfield and fluorescence illumination, showing organic contamination on a wafer surface.")
随着半导体上集成电路（IC）的尺寸低于10纳米，在晶圆检测中有效检测光刻胶残留等有机污染物和缺陷变得越来越重要。光学显微镜仍然是常见的检测方法，但对于有机污染物，明场和其他类型的照明可能会存在局限性。…
![[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.](/fileadmin/_processed_/9/1/csm_Processed_wafer_standard_and_oblique_brightfield_illumination_c01940e12e.jpg "[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illuminati")
![[Translate to chinese:] Efficient investigation and documentation of automotive parts and components with the DVM6 digital microscope.](/fileadmin/_processed_/f/3/csm_dvm6_auto_fig_workflow_dez_2021_2fc98d9eb5.jpg "[Translate to chinese:] Efficient investigation and documentation of automotive parts and components with the DVM6 digital microscope.")
![[Translate to chinese:] 3D image with line profile](/fileadmin/_processed_/5/d/csm_clutch_disc_frcition_surface_chart_auto_report_210fac2103.jpg "[Translate to chinese:] 3D image with line profile")
![[Translate to chinese:] 3D image with step height.](/fileadmin/academy/2022/Verifying_specifications_for_auto_parts_and_components_Rework/clutch_disc_hub_chart_auto_report.jpg "[Translate to chinese:] 3D image with step height.")
![[Translate to chinese:] 3D image with step height and angle.](/fileadmin/_processed_/1/e/csm_sprocket_chart_auto_report_51b7a6a541.jpg "[Translate to chinese:] 3D image with step height and angle.")
![[Translate to chinese:] Images of scratches on the painted surface of a metal plate from an automobile body.](/fileadmin/academy/2022/Verifying_specifications_for_auto_parts_and_components_Rework/plate_body_chart_auto_report.jpg "[Translate to chinese:] Images of scratches on the painted surface of a metal plate from an automobile body.")
